*rohs directive 2002/95/ec jan 27, 2003 including annex.. specifications are subject to change without notice. customers should verify actual device performance in their specific applications. ci160808 series - multi-layer chip inductors *rohs compliant bourns part no. inductance q test freq. srf mhz dcr i rms nh tol. % min. l,q mhz min. typ. ohm max. ma max. ci160808-1n0d 1.0 0.3 nh 8 100 4000 13000 0.10 300 ci160808-1n2d 1.2 0.3 nh 8 100 4000 13000 0.10 300 ci160808-1n5d 1.5 0.3 nh 8 100 4000 10000 0.10 300 ci160808-1n8d 1.8 0.3 nh 8 100 3800 10000 0.12 300 ci160808-2n2d 2.2 0.3 nh 8 100 3600 10000 0.16 300 ci160808-2n7d 2.7 0.3 nh 8 100 3400 8000 0.20 300 ci160808-3n3d 3.3 0.3 nh 10 100 3200 6000 0.22 300 ci160808-3n9d 3.9 0.3 nh 10 100 3000 6000 0.25 300 ci160808-4n7d 4.7 0.3 nh 10 100 2800 5000 0.28 300 ci160808-5n6d 5.6 0.3 nh 10 100 2700 5000 0.29 300 ci160808-6n8j 6.8 5 10 100 2600 4000 0.30 300 ci160808-8n2j 8.2 5 10 100 2200 4000 0.33 300 ci160808-10nj 10 5 10 100 1800 3000 0.35 300 ci160808-12nj 12 5 10 100 1650 2700 0.40 300 CI160808-15NJ 15 5 10 100 1350 2400 0.45 300 ci160808-18nj 18 5 10 100 1350 2050 0.50 300 ci160808-22nj 22 5 10 100 1100 1850 0.55 300 ci160808-27nj 27 5 10 100 1100 1750 0.60 300 ci160808-33nj 33 5 10 100 1000 1500 0.65 300 ci160808-39nj 39 5 10 100 900 1350 0.70 300 ci160808-47nj 47 5 10 100 800 1200 0.90 300 ci160808-56nj 56 5 10 100 750 1150 1.00 300 ci160808-68nj 68 5 10 100 700 1000 1.20 300 ci160808-82nj 82 5 10 100 600 900 1.50 300 ci160808-r10j 100 5 10 100 500 850 1.70 300 ci160808-r12j 120 5 8 50 500 850 2.00 250 ci160808-r15j 150 5 8 50 500 680 2.40 200 ci160808-r18j 180 5 8 50 400 500 2.70 200 ci160808-r22j 220 5 8 50 350 500 2.80 200 9.0 (.354) 12.0 (.472) 2.0 0.5 (.079 .020) 50.0 (1.969) 178.0 (7.00) dia. 13.0 0.5 (.512 .020) dia. 13.0 0.5 (.512 .020) dia. 21.0 0.8 (.827 .031) packaging specifications features 0603 size available in e12 series high frequency nickel barrier applications mobile phones cellular phones ctv, vcr, hic, fdd automotive electronics electrical specifications product dimensions recommended layout 1.6 0.15 (.063 .006) 0.5 (.020) max. 0.8 0.15 (.031 .006) 0.8 0.15 (.031 .006) general specifications temperature rise ...................20 ?c max. at rated current operating temperature .-55 c to +125 c storage temperature..-55 c to +125 c reflow soldering ...230 c, 50 sec. max. resistance to soldering heat ...............................260 ?c, 10 seconds materials base material .............................ceramic terminal.....................................ag/ni/sn packaging..................4,000 pcs. per reel 1.3 (.051) ref. ref. 0.5 (0.02) ref. 1.0 (.039) ref. 1.0 (.039) dimensions: mm (inches)
specifications are subject to change without notice. customers should verify actual device performance in their specific applications. surface mount chip inductor capability matrix rev. 05/11 ci160808 series - multi-layer chip inductors 100 10 1 inductance (nh) frequency (mhz) inductance characteristics 10 100 1000 1000 10000 4.7nh 6.8nh 10nh 22nh 100 10 0 q frequency (mhz) q characteristics 20 40 60 80 100 1000 10000 22nh 10nh 6.8nh 4.7nh electrical specifications
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